DocumentCode
1714433
Title
Advances in fine pitch lead free assembly process
Author
Doraiswarni, R. ; Sankaxwaman, S. ; Kim, Woopoung ; Li, Jing ; Zhang, Zhuqing ; Gupta, Piyush ; Nakanishi, Kensuke ; Borkar, Manish ; Madhavan, Raghav ; Govind, Vinu ; Choi, Suna ; Aggarwal, Ankur O. ; Sun, Y. ; Fan, Lianhua ; Sundaram, Venky ; Swaminatha
Author_Institution
Harima Chemicals, INC.
fYear
2003
Firstpage
834
Lastpage
839
Keywords
Assembly; Chemical technology; Coplanar waveguides; Dielectric losses; Environmentally friendly manufacturing techniques; Lead; Packaging; Passivation; Printing; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216386
Filename
1216386
Link To Document