1714433

Advances in fine pitch lead free assembly process

Doraiswarni, R. ; Sankaxwaman, S. ; Kim, Woopoung ; Li, Jing ; Zhang, Zhuqing ; Gupta, Piyush ; Nakanishi, Kensuke ; Borkar, Manish ; Madhavan, Raghav ; Govind, Vinu ; Choi, Suna ; Aggarwal, Ankur O. ; Sun, Y. ; Fan, Lianhua ; Sundaram, Venky ; Swaminatha

Harima Chemicals, INC.

2003

834

839

Assembly; Chemical technology; Coplanar waveguides; Dielectric losses; Environmentally friendly manufacturing techniques; Lead; Packaging; Passivation; Printing; Wafer scale integration;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216386

1216386