DocumentCode

1714463

Title

Fluxless flip chip technique with Sn-rich Au/Sn solder bumps

Author

Kim, Dongwook ; Lee, Chin C. ; Sokolowski, Witold M.

Author_Institution

University of California

fYear

2003

Firstpage

840

Lastpage

843

Keywords

Assembly; Bonding processes; Dispersion; Flip chip; Glass; Gold; Microstructure; Scanning electron microscopy; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216387

Filename

1216387