Title :
Fluxless flip chip technique with Sn-rich Au/Sn solder bumps
Author :
Kim, Dongwook ; Lee, Chin C. ; Sokolowski, Witold M.
Author_Institution :
University of California
Keywords :
Assembly; Bonding processes; Dispersion; Flip chip; Glass; Gold; Microstructure; Scanning electron microscopy; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216387
