DocumentCode
1714547
Title
An analysis of the reliability of a wafer level package (WLP) using a silicone under the bump (SUB) configuration
Author
Gonzalez, M. ; Vandevelde, B. ; BuIcke, M.V. ; Winters, C. ; Beyne, E. ; Lee, Y.J. ; Larson, Lawrence ; HArkness, B.R. ; Mohamed, M. ; Meynen, H. ; Vanlathem, E.
Author_Institution
IMEC
fYear
2003
Firstpage
857
Lastpage
863
Keywords
Capacitive sensors; Integrated circuit reliability; Lead; Material properties; Metallization; Packaging; Plastics; Soldering; Thermal stresses; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216391
Filename
1216391
Link To Document