Multi-chip memory module vvith a flip-chip-on-chip structure and an optional center via hole for underfill dispensing

Author

Lee, S. W Ricky ; Tsui, Yat Kit ; So, Raymond ; Luo, Le

Author_Institution

Hong Kong University of Science & Technology

fYear

2003

Firstpage

864

Lastpage

869

Keywords

Assembly; Costs; Electronics packaging; Encapsulation; Fabrication; Flip chip; Random access memory; Silicon; Soldering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

DOI

10.1109/ECTC.2003.1216392

Filename

1216392

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