Title :
Multi-chip memory module vvith a flip-chip-on-chip structure and an optional center via hole for underfill dispensing
Author :
Lee, S. W Ricky ; Tsui, Yat Kit ; So, Raymond ; Luo, Le
Author_Institution :
Hong Kong University of Science & Technology
Keywords :
Assembly; Costs; Electronics packaging; Encapsulation; Fabrication; Flip chip; Random access memory; Silicon; Soldering; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216392
