Title :
Highly reliable and low-cost multi-chip module composed of wafer process packages
Author :
Naka, Yasuhiro ; Tanaka, Naotaka ; Naito, Takahiro
Author_Institution :
Hitachi, Ltd.
Keywords :
Costs; Digital cameras; Electronic packaging thermal management; Integrated circuit packaging; Integrated circuit reliability; Semiconductor device packaging; Soldering; Substrates; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216395
