Title :
A non-destructive visual failure analysis technique for cracked BGA interconnects
Author :
Bragg, Jason ; Bookbinder, Justine ; Sanders, George ; Harper, Blake
Author_Institution :
Celestica Intemational Inc.
Keywords :
Assembly; Capacitive sensors; Circuit testing; Endoscopes; Failure analysis; Force control; Inspection; Integrated circuit interconnections; Manufacturing; Soldering;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216396
