• DocumentCode
    1714781
  • Title

    Understanding the effect of dwell time on fatigue life of packages using thermal shock and intrinsic material behavior

  • Author

    Sahasrabudhe, Sameer ; Monroe, Eric ; Tandon, Shalabh ; Patel, Mitesh

  • Author_Institution
    Intel Corporation
  • fYear
    2003
  • Firstpage
    898
  • Lastpage
    904
  • Keywords
    Electric shock; Electronic packaging thermal management; Fatigue; Life estimation; Life testing; Material properties; Materials reliability; Stress; Temperature; Thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216398
  • Filename
    1216398
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1714781