• DocumentCode
    1714850
  • Title

    Application of digital speckle correlation to micro-deformation measurement of a flip chip assembly

  • Author

    Pang, John H L ; Shi, X.Q. ; Zhang, X.R. ; Liu, Q.J.

  • Author_Institution
    Nanyang Technological University
  • fYear
    2003
  • Firstpage
    926
  • Lastpage
    932
  • Keywords
    Adaptive optics; Assembly; Digital images; Electronic packaging thermal management; Electronics packaging; Flip chip; Optical interferometry; Semiconductor device measurement; Soldering; Speckle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216401
  • Filename
    1216401
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1714850