DocumentCode
1714856
Title
Highly accurate and quick bonding for planar lightwave circuit and laser-diode chip
Author
Sawada, R. ; Nakada, H. ; Ohira, F.
Author_Institution
NTT Opto-electron. Labs., Tokyo, Japan
fYear
1998
Firstpage
133
Lastpage
137
Abstract
A new method for accurately and quickly bonding a planar light waveguide circuit (PLC) and a laser diode is proposed. The method is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the proposed method was accurate within /spl plusmn/1 /spl mu/m. The turnaround time, from picking up the laser diode with vacuum tweezers to completion of the bonding process, was 2 1/4 minutes.
Keywords
microassembling; optical focusing; optical planar waveguides; optical workshop techniques; semiconductor lasers; 2.25 min; alignment marks; auto-focusing; bonding; bonding accuracy; bonding equipment; bonding process; bonding speed; laser diode; laser-diode chip; planar light waveguide circuit; planar lightwave circuit; turnaround time; vacuum tweezers; Bonding; Circuits; Diode lasers; Focusing; Optical surface waves; Optical waveguides; Programmable control; Semiconductor films; Silicon; Surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 2nd 1998
Conference_Location
Tokyo, Japan
Print_ISBN
0-7803-5090-1
Type
conf
DOI
10.1109/IEMTIM.1998.704539
Filename
704539
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