DocumentCode
1714908
Title
Novel reworkable fluxing underfill for board level assembly
Author
Zhang, Zhuqing ; Li, Haiying ; Wong, C.P.
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
940
Lastpage
945
Keywords
Assembly; Chip scale packaging; Electric shock; Electronics packaging; Materials science and technology; Soldering; Surface-mount technology; Temperature; Thermal stresses; Vehicle dynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216403
Filename
1216403
Link To Document