Title :
The effects of rheological properties on underfifl processing
Author_Institution :
Intel Corporation
Keywords :
Aging; Curing; Environmentally friendly manufacturing techniques; Packaging; Performance evaluation; Rheology; Stress; Temperature measurement; Testing; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216404
