Effects on etching rates of copper in ferric chloride solutions

Author

Jian, Cai ; Jusheng, Ma ; Gangqiang, Wang ; Xiangyun, Tang

Author_Institution

Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China

fYear

1998

Firstpage

144

Lastpage

148

Abstract

The influences of several factors on the etching rates of Cu in FeCl₃ etchant are studied with a spray etching apparatus in this paper. The Cu etching surfaces are analyzed by XRD, and it is shown that there is a CuCl passivation film on the etching surface. A brief explanation is offered based on the relationship between etching rate and etching time. It indicates that cations influence the etching rate as the effects of different chlorides on etching rates have been studied. Additionally, the quantity of copper dissolved in FeCl₃ etchant and regeneration of spent etchants are also investigated in this paper

Keywords

X-ray diffraction; copper; etching; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; iron compounds; passivation; positive ions; surface chemistry; Cu; Cu etching rate; Cu etching surfaces; CuCl passivation film; FeCl₃; FeCl₃ etchant; IC packaging; XRD analysis; cations; copper etching; dissolved copper; etching rate; etching rates; etching surface; etching time; ferric chloride solutions; lead frames; spent etchant regeneration; spray etching apparatus; Copper alloys; Electronic packaging thermal management; Electronics packaging; Etching; Iron alloys; Lead; Materials science and technology; Photochemistry; Spraying; X-ray scattering;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 2nd 1998

Conference_Location

Tokyo

Print_ISBN

0-7803-5090-1

Type

conf

DOI

10.1109/IEMTIM.1998.704541

Filename

704541