DocumentCode
1714947
Title
Nanocomposite underfills for flip-chip applications
Author
Gross, Kenny ; Schultz, Wolfram ; Thompson, Willem
Author_Institution
3M Company
fYear
2003
Firstpage
951
Lastpage
956
Keywords
Assembly; Bonding; Material properties; Materials science and technology; Packaging; Silicon compounds; Soldering; Thermal expansion; Thermal stresses; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216405
Filename
1216405
Link To Document