DocumentCode

1714953

Title

Underfill-induced stresses in flip chip assemblies

Author

Hurley, James M. ; Berfield, Tanya L.

Author_Institution

Cookson Electronics-Assembly Materials Groups

fYear

2003

Firstpage

957

Lastpage

961

Keywords

Assembly; Capacitive sensors; Flip chip; Laminates; Monitoring; Soldering; Stress measurement; Testing; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216406

Filename

1216406