DocumentCode :
1714972
Title :
Lead-free molded underfill technology for exposed die flip chip packages assembled in a molded matrix array packages form
Author :
Chee, Choong Kooi ; Lim, Szu Shmg ; Rudge, Va ; Periaman, Shanggar ; Ong, Ai Lin ; Chan, Hwa Wei ; Then, Edward
Author_Institution :
Penang Package FA
fYear :
2003
Firstpage :
962
Lastpage :
970
Keywords :
Assembly; Environmentally friendly manufacturing techniques; Flip chip; Heat sinks; Lead; Packaging; Semiconductor materials; Stress; Substrates; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216407
Filename :
1216407
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1714972
