• DocumentCode
    1715066
  • Title

    Accurate HSPICE modeling of arbitrary package geometries using transmission-line equivalent techniques

  • Author

    Budell, T. ; Clouser, P. ; Tremble, E. ; Welch, B.

  • Author_Institution
    IBM Corporation
  • fYear
    2003
  • Firstpage
    988
  • Lastpage
    1003
  • Keywords
    Application specific integrated circuits; Equivalent circuits; Geometry; Power transmission lines; Semiconductor device noise; Semiconductor device packaging; Solid modeling; Stripline; Switching frequency; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216411
  • Filename
    1216411
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1715066