DocumentCode
1715159
Title
Accurate modeling of multilayer packaging structures with a hybrid FDTD method
Author
Dalton, Edan T K ; Kunze, Marco ; Heinrich, Wolfgang ; Tentzeris, Manos M.
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
1028
Lastpage
1031
Keywords
Computational modeling; Conducting materials; Finite difference methods; Inorganic materials; Integral equations; Metallization; Nonhomogeneous media; Packaging; Radio frequency; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216416
Filename
1216416
Link To Document