DocumentCode :
1715159
Title :
Accurate modeling of multilayer packaging structures with a hybrid FDTD method
Author :
Dalton, Edan T K ; Kunze, Marco ; Heinrich, Wolfgang ; Tentzeris, Manos M.
Author_Institution :
Georgia Institute of Technology
fYear :
2003
Firstpage :
1028
Lastpage :
1031
Keywords :
Computational modeling; Conducting materials; Finite difference methods; Inorganic materials; Integral equations; Metallization; Nonhomogeneous media; Packaging; Radio frequency; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216416
Filename :
1216416
Link To Document :
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