Title :
Multi-channel optical interconnects for short-reach applications
Author_Institution :
Agilent Technologies Laboratories
Keywords :
Backplanes; Connectors; Copper; Costs; Dielectric losses; Dielectric substrates; Optical arrays; Optical crosstalk; Optical fiber devices; Optical interconnections;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216417
