DocumentCode

1715363

Title

Chip-to-wafer stacking technology for 3D system integration

Author

Klumpp, Armin ; Merkel, Reinhard ; Wieland, Robert ; Ramm, Peter

Author_Institution

Fraunhofer Institute for Reliability and Microintegration IZM

fYear

2003

Firstpage

1080

Lastpage

1083

Keywords

Contacts; Copper; Etching; Fabrication; Metallization; Microelectronics; Soldering; Stacking; Wafer bonding; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216424

Filename

1216424