Title :
Ultra-high-density 3D chip stacking technology
Author :
Tanida, Kazumasa ; Umemoto, Mitsuo ; Tomita, Yoshihiro ; Tago, Masamoto ; Nemoto, Yoshihko ; Ando, Tatsuya ; Takahashi, Kenji
Author_Institution :
Association of Super-Advanced Electronics Technologies (ASET)
Keywords :
Bonding; Costs; Electrodes; Electronics packaging; Large scale integration; Packaging machines; Preforms; Stacking; Temperature; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216425
