DocumentCode
1715405
Title
Planar metallization intemonnected 3-D multi-chip module
Author
Liang, Zhenxian ; van Wyk, J.D.
Author_Institution
Power Electronics Integrated Packaging Lab.
fYear
2003
Firstpage
1090
Lastpage
1094
Keywords
Artificial intelligence; Assembly; Chip scale packaging; Electronics packaging; Manufacturing; Metallization; Optical device fabrication; Packaging machines; Power electronics; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216426
Filename
1216426
Link To Document