Title :
Design and stacking of an extremely thin chip-scale package
Author :
Yoshida, Akito ; Ishibashi, Kamo
Author_Institution :
Amkor Technology Inc.
Keywords :
Bonding; Chip scale packaging; Costs; Encapsulation; Laminates; Lead; Logic devices; Logistics; Stacking; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216427
