DocumentCode
1715447
Title
Recent advances in InP PICs
Author
Coldren, Larry A.
Author_Institution
Electr. & Comput. Eng. & Mater. Depts., Univ. of California, Santa Barbara, CA
fYear
2009
Firstpage
1
Lastpage
2
Abstract
Within the past couple of years InP-based Photonic Integrated Circuits (PICs) have become the subject of aggressive development for commercial applications primarily for the telecommunications industry. Chips with hundreds of photonic components carry live traffic in the field, but questions remain about cost/volume/performance tradeoffs, as well as the need for common integration platforms and/or foundry services. Research efforts have been influenced by these issues.
Keywords
III-V semiconductors; indium compounds; integrated optics; InP; foundry services; integration platforms; photonic components; photonic integrated circuits; telecommunication industry; Absorption; High speed optical techniques; Indium phosphide; Integrated optics; Optical receivers; Optical transmitters; Optical waveguides; Waveguide junctions; Waveguide lasers; Waveguide transitions;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide & Related Materials, 2009. IPRM '09. IEEE International Conference on
Conference_Location
Newport Beach, CA
ISSN
1092-8669
Print_ISBN
978-1-4244-3432-9
Electronic_ISBN
1092-8669
Type
conf
DOI
10.1109/ICIPRM.2009.5012430
Filename
5012430
Link To Document