Title :
Failure analysis of full delamination on the stacked die leaded packages
Author :
Lin, T.Y. ; Xiong, Z.P. ; Yao, Y.F. ; Tok, Lane ; Yue, Z.Y. ; Njurnan, B. ; Chua, K.H.
Author_Institution :
Agere Systems Singapore Pie Ltd.
Keywords :
Bonding; Delamination; Electronics packaging; Failure analysis; Integrated circuit packaging; Microassembly; Space technology; Stacking; Temperature; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216440
