Title :
Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
Author :
Choi, Won Kyoung ; Kang, Sung K. ; Sohn, Yoon Chul ; Shih, Da-Yuan
Author_Institution :
IBM T.J. Watson Research Center
Keywords :
Intermetallic; Kinetic theory; Lead; Metallization; Microelectronics; Microstructure; Morphology; Soldering; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216443
