1715844

Reliability evaluation structures for stacked thin dice packaging

Karjalainen, Pävi ; Tanskanen, Jarmo ; Ristolainen, Eero O.

Tampere University of Technology

2003

1197

1202

Assembly; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Flip chip; Heat sinks; Integrated circuit interconnections; Integrated circuit packaging; Semiconductor device packaging; Thermal stresses;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216444

1216444