Title :
Comparison of interfacial reactions and reliabilifies of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs
Author :
Jeon, Young-Doo ; Ostmann, Adreas ; Reichl, Herbert ; Paik, Kyung-Wook
Author_Institution :
Korea Advanced Institute of Science and Technology
Keywords :
Aging; Costs; Flip chip; Materials reliability; Materials science and technology; Reliability engineering; Soldering; Temperature; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216445
