Title :
Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories
Author :
Lehman, L.P. ; Kinyanjui, R.K. ; Zavalij, L. ; Zribi, A. ; Cotts, E.J.
Author_Institution :
Binghamton University
Keywords :
Atherosclerosis; Copper; Electronic packaging thermal management; Electronics cooling; Electronics industry; History; Intermetallic; Morphology; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216447
