DocumentCode
1715891
Title
Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories
Author
Lehman, L.P. ; Kinyanjui, R.K. ; Zavalij, L. ; Zribi, A. ; Cotts, E.J.
Author_Institution
Binghamton University
fYear
2003
Firstpage
1215
Lastpage
1221
Keywords
Atherosclerosis; Copper; Electronic packaging thermal management; Electronics cooling; Electronics industry; History; Intermetallic; Morphology; Temperature; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216447
Filename
1216447
Link To Document