• DocumentCode
    1715923
  • Title

    UBM integrity studies on copper/low-k dielectrics for fine pitch flip chip packaging

  • Author

    Yoon, Seung Wook ; Kripesh, Vaidyanathan ; Kwan, Wong Wai ; Yong, Li Chao ; Tong, Chen Xian ; Dong, Gui ; Rasiah, Ignatius J. ; Iyer, Mahadevan K.

  • Author_Institution
    Institute of Microelectronics
  • fYear
    2003
  • Firstpage
    1222
  • Lastpage
    1229
  • Keywords
    Aluminum; Chemical technology; Copper; Dielectric materials; Failure analysis; Flip chip; Integrated circuit interconnections; Integrated circuit packaging; Metallization; Optical microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216448
  • Filename
    1216448
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1715923