Title :
Investigation of Co UBM for direct bumping on Cu/LowK dies
Author :
Labie, Riet ; Beyne, Eric ; Ratchev, Petar
Author_Institution :
IMEC
Keywords :
Annealing; CMOS technology; Degradation; Delay; Environmentally friendly manufacturing techniques; Lead; Ovens; Sputtering; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216449
