DocumentCode

1715958

Title

Investigation of Co UBM for direct bumping on Cu/LowK dies

Author

Labie, Riet ; Beyne, Eric ; Ratchev, Petar

Author_Institution

IMEC

fYear

2003

Firstpage

1230

Lastpage

1234

Keywords

Annealing; CMOS technology; Degradation; Delay; Environmentally friendly manufacturing techniques; Lead; Ovens; Sputtering; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216449

Filename

1216449