Title :
Effects of antimony on the growth of intermetallic compounds in Sa-Ag-Cu Pb-free solder joints
Author :
Chen, B.L. ; Li, G.Y.
Author_Institution :
Nanyang Technological University
Keywords :
Copper; Environmentally friendly manufacturing techniques; Grain boundaries; Intermetallic; Joining materials; Kinetic theory; Lead; Optical microscopy; Scanning electron microscopy; Soldering;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216450
