Title :
Interfacial reaction of eutectic AuSi solder with Si
Author :
Jang, Jin-Wook ; Hayes, Scott ; Lin, Jong-Kai ; Frear, Darrel
Author_Institution :
Motorola
Keywords :
Assembly; Bonding; Etching; Microassembly; Rough surfaces; Scanning electron microscopy; Silicon alloys; Soldering; Surface morphology; Surface roughness;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216451
