DocumentCode
1716035
Title
Model-to-hardware correlations in the design of a 50Gb/s package
Author
Shan, Lei ; Meghelli, Mounir ; Rylyakov, Alexander ; Trewhella, Jean ; Oprysko, Modest
Author_Institution
IBM Corporation
fYear
2003
Firstpage
1248
Lastpage
1252
Keywords
Coaxial components; Connectors; Frequency; Germanium silicon alloys; Multiplexing; Packaging; Predictive models; Scattering parameters; Silicon germanium; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216452
Filename
1216452
Link To Document