Title :
Model-to-hardware correlations in the design of a 50Gb/s package
Author :
Shan, Lei ; Meghelli, Mounir ; Rylyakov, Alexander ; Trewhella, Jean ; Oprysko, Modest
Author_Institution :
IBM Corporation
Keywords :
Coaxial components; Connectors; Frequency; Germanium silicon alloys; Multiplexing; Packaging; Predictive models; Scattering parameters; Silicon germanium; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216452
