Title :
Dynamic and quasi-static three dimensional simulation of wire-looping process in wirebonding
Author :
Tay, A.A.O. ; Ng, B.H. ; Ong, S.H.
Author_Institution :
National University of Singapore
Keywords :
Analytical models; Bonding processes; Capacitive sensors; Computational modeling; Computer simulation; Gold; Packaging; Probes; Solid modeling; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216467
