• DocumentCode
    1716396
  • Title

    Research on Parametric Drift in ESD-injected Silicon Dynatron Transistors

  • Author

    Jie, Yang ; Shanghe, Liu ; Qingyun, Yuan ; Guozhi, Sun

  • Author_Institution
    Shijiazhuang Mech. Eng. Coll., Shijiazhuang
  • fYear
    2007
  • Abstract
    Currently, with the extensive application of electronic devices and systems, the interests in ESD failure in electronic devices had mushroomed rapidly. There were many approaches to analysis static failures. The electronic parametric measurement was the most common approach for parts detection. With high-frequency low-noise Silicon dynatron transistors, in order to find the most sensitive parameter of ESD damage/failure, nearly all the normal electrical characteristics were measured and compared before and after ESD injection. By statistic and analysis, it was observed that saturation falloff, forward break-over voltage, correlated power gain, noise figure and junction capacitance were not sensitive to ESD, reverse breakdown voltages and cutoff currents were more sensitive. Especially, VBRCEO and ICEO of high-frequency low-noise Silicon dynatron transistors were the most sensitive to ESD injection.
  • Keywords
    electrostatic discharge; parametric devices; silicon; statistical analysis; transistors; ESD failure; ESD injected silicon; ICEO; VBRCEO; correlated power gain; cutoff currents; dynatron transistors; electronic parametric measurement; forward break over voltage; junction capacitance; noise figure; parametric drift; reverse breakdown voltages; saturation falloff; statistical analysis; Breakdown voltage; Capacitance; Electric variables; Electric variables measurement; Electrostatic discharge; Failure analysis; Noise figure; Parametric statistics; Silicon; Statistical analysis; ESD damage; Silicon bipolar transistor; cutoff current; parametric drifts; reverse breakdown voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Measurement and Instruments, 2007. ICEMI '07. 8th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-1136-8
  • Electronic_ISBN
    978-1-4244-1136-8
  • Type

    conf

  • DOI
    10.1109/ICEMI.2007.4350402
  • Filename
    4350402