DocumentCode :
1716414
Title :
Assembly challenges related to fine pitch in-line and staggered bond pad devices
Author :
Ruston, Matt ; Tran, Tu Anh ; Yong, Lois ; Youngblood, Alvin ; Ravenscraft, Dennis ; Harun, Fuaida ; Mui, Kok Wai
Author_Institution :
Motorola
fYear :
2003
Firstpage :
1334
Lastpage :
1343
Keywords :
Assembly; Atherosclerosis; Electronics industry; Manufacturing industries; Semiconductor device packaging; Silicon; Spine; Stability; Wafer bonding; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216468
Filename :
1216468
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1716414
