DocumentCode
1716414
Title
Assembly challenges related to fine pitch in-line and staggered bond pad devices
Author
Ruston, Matt ; Tran, Tu Anh ; Yong, Lois ; Youngblood, Alvin ; Ravenscraft, Dennis ; Harun, Fuaida ; Mui, Kok Wai
Author_Institution
Motorola
fYear
2003
Firstpage
1334
Lastpage
1343
Keywords
Assembly; Atherosclerosis; Electronics industry; Manufacturing industries; Semiconductor device packaging; Silicon; Spine; Stability; Wafer bonding; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216468
Filename
1216468
Link To Document