DocumentCode :
1716475
Title :
Problems with wirebonding on probe marks and possible solutions
Author :
Sauter, Wolfgang ; Aoki, Toyohiro ; Hisada, Takasbi ; Miyai, Hirumitsu ; Petrarea, K. ; Beaulied, F. ; Allard, Stephanie ; Power, Jennifer ; Agbesi, Michael
Author_Institution :
Semiconductor Packaging and Test IBM USA
fYear :
2003
Firstpage :
1350
Lastpage :
1358
Keywords :
Artificial intelligence; Frequency; Integrated circuit packaging; Manufacturing; Probes; Rivers; Semiconductor device measurement; Semiconductor device packaging; Size measurement; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216470
Filename :
1216470
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1716475
