Title :
Improving the deflection of wire bonds in stacked chip scale package (CSP)
Author :
Yao, Y.F. ; Lin, T.Y. ; Chua, K.H.
Author_Institution :
Agere Systems Singapore Pte Ltd.
Keywords :
Bonding; Chip scale packaging; Gold; Integrated circuit packaging; Microassembly; Plasma temperature; Scanning electron microscopy; Shape; Thermal conductivity; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216471
