DocumentCode :
1716652
Title :
Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications
Author :
Yim, Myung-Jin ; Jung, In Ho ; Choi, Hyung-Kyu ; Kim, Kijoong ; Hwang, Jim-Sang ; Ahn, Jin-Yong ; Kwon, Woonseong ; Paik, Kyung Wook
Author_Institution :
Telephus, Inc.
fYear :
2003
Firstpage :
1398
Lastpage :
1403
Keywords :
Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Costs; Flip chip; Gold; Integrated circuit interconnections; Packaging; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216477
Filename :
1216477
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1716652
