Title :
Split-ground effects of electronic package on the input-level of high-speed DRAM
Author :
Lee, Jongjoo ; Choi, Junghwan ; Lee, Dong-Ho
Author_Institution :
Samsung Electronics Co., Ltd.
Keywords :
Electronics packaging; Frequency estimation; Integrated circuit interconnections; Power system interconnection; Power system modeling; Random access memory; SPICE; Scattering parameters; Semiconductor device measurement; Signal design;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216484
