Title :
Package electrical specifications for giga bit signaling I/Os
Author :
Shrivastava, U.A. ; Prokofiev, Victor ; Lee, Chee Hoo ; Augustine, Anne ; Polka, Lesley
Author_Institution :
Intel Corporation
Keywords :
Central Processing Unit; Costs; Frequency domain analysis; Integrated circuit interconnections; Manufacturing; Measurement; Packaging; SONET; Scattering parameters; System performance;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216486