Title :
Lead-free solder bumping process for high temperature automotive application
Author :
Teutsch, Thorsten ; Blankenhorn, R.G. ; Zakel, Elke
Author_Institution :
Pac Tech USA - Packaging Technologies, Inc.
Keywords :
Assembly; Automotive applications; Costs; Environmentally friendly manufacturing techniques; Lead; Nickel; Printing; Production; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216489
