Title :
Establishing control factors of intermetallic formation mithin Pb-free solder bumps at flip chip gometries
Author :
Jackson, G.J. ; Hendriksen, M.W. ; Horsley, R. ; Hoo, N. ; Salam, B. ; Ekere, N.N.
Author_Institution :
University of Greenwich
Keywords :
Aging; Flip chip; Heating; Intermetallic; Manufacturing; Microstructure; Reliability engineering; Soldering; Surface morphology; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216490
