• DocumentCode
    1716978
  • Title

    Establishing control factors of intermetallic formation mithin Pb-free solder bumps at flip chip gometries

  • Author

    Jackson, G.J. ; Hendriksen, M.W. ; Horsley, R. ; Hoo, N. ; Salam, B. ; Ekere, N.N.

  • Author_Institution
    University of Greenwich
  • fYear
    2003
  • Firstpage
    1472
  • Lastpage
    1479
  • Keywords
    Aging; Flip chip; Heating; Intermetallic; Manufacturing; Microstructure; Reliability engineering; Soldering; Surface morphology; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216490
  • Filename
    1216490
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1716978