Title :
Analysis of high-Q on-chip inductors realized by wafer-level packaging techniques
Author :
Sun, X. ; Carchon, G. ; De Raedt, W. ; Beyne, E.
Author_Institution :
IMEC
Keywords :
Artificial intelligence; Dielectric losses; Dielectric substrates; Electromagnetic analysis; Passivation; Radio frequency; Silicon; Spirals; Thin film inductors; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216496
