Title :
Variations in package radiation due to changes in on-die and on-package capacitance
Author :
Hill, Michael J. ; He, Jiangqi ; Parmar, Prashant
Author_Institution :
Intel Corporation
Keywords :
Capacitance; Clocks; Computational modeling; Electromagnetic compatibility; Electromagnetic interference; Electronics packaging; Frequency; Integrated circuit packaging; Microprocessors; Semiconductor device measurement;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216506
