Title :
Test structures for characterising a damascene CMP interconnect process
Author :
Peyne, C.M. ; O´Hara, A. ; Stevenson, J.T.M. ; Elliott, J.P. ; Walton, A.J. ; Fallon, M.
Author_Institution :
EKC Technol. Ltd., East Kilbride, UK
Abstract :
This paper presents some test structures that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling
Keywords :
integrated circuit interconnections; integrated circuit testing; polishing; AFM; chemical mechanical polishing; damascene CMP interconnect process; electrical measurement; surface profiling; test structure; Aluminum; Atomic measurements; Conducting materials; Copper; Dielectric materials; Dielectric measurements; Etching; Surface topography; Testing; Textile industry;
Conference_Titel :
Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-3243-1
DOI :
10.1109/ICMTS.1997.589369
