Title :
Electrical analysis and simulation solution for RF SAW filter package
Author :
Kim, Dongyoung ; Jang, Heuisung ; Hwang, Sungkil
Author_Institution :
LG Innotek Components R/D Center
Keywords :
Analytical models; Circuit testing; Costs; Flip chip; Insertion loss; Packaging; Radio frequency; SAW filters; Signal analysis; Surface acoustic waves;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216508
