• DocumentCode
    1717565
  • Title

    Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages

  • Author

    Lee, Junwoo ; Seng, Yeo Mui ; Rotaru, Mihai Dragos ; lyer, M.K. ; Kim, Joungho

  • Author_Institution
    Korea Advanced Institute of Science and Technology
  • fYear
    2003
  • Firstpage
    1589
  • Lastpage
    1593
  • Keywords
    Analytical models; Cavity resonators; Circuit noise; Coupling circuits; Magnetic fields; Noise level; Packaging; Power distribution; Power system modeling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216510
  • Filename
    1216510
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1717565