Title :
SPICE electrothermal modeling of power integrated circuits
Author :
Maxim, Adrian ; Andreu, Danielle ; Boucher, Jacques
Author_Institution :
Dept. of Electron., Tech. Univ. Iasi, Romania
Abstract :
A new analog behavioral modeling method for mixed electrical-thermal SPICE simulations was developed. It can be applied to power integrated circuits as well as to VLSI circuit simulation, where the devices exhibit a dynamic electrothermal behavior. Both the electrical and thermal laws are modeled by means of “in line equation” controlled sources, which form a global electrical equivalent circuit, that can be analyzed with a general purpose circuit simulator. The proposed electrothermal macromodel greatly increases the simulation accuracy and the analysis time is comparable with that of standard intrinsic SPICE models
Keywords :
SPICE; VLSI; circuit analysis computing; equivalent circuits; integrated circuit modelling; power integrated circuits; SPICE electrothermal modeling; VLSI circuits simulation; analog behavioral modeling method; analysis time; dynamic electrothermal behavior; electrothermal macromodel; general purpose circuit simulator; global electrical equivalent circuit; in line equation controlled sources; mixed electrical-thermal SPICE simulations; power integrated circuits; simulation accuracy; Analytical models; Circuit simulation; Electrothermal effects; Equations; Equivalent circuits; Integrated circuit modeling; Mathematical model; Power integrated circuits; SPICE; Very large scale integration;
Conference_Titel :
Microelectronics, 1997. Proceedings., 1997 21st International Conference on
Conference_Location :
Nis
Print_ISBN :
0-7803-3664-X
DOI :
10.1109/ICMEL.1997.632873
