DocumentCode
1717729
Title
A method of multi-node thermal network extraction for SPICE compatible simulations
Author
Shan, Lei ; Kuchta, Daniel ; Young Kwark
Author_Institution
IBM Corporation
fYear
2003
Firstpage
1631
Lastpage
1635
Keywords
Circuit simulation; Impedance; Laser modes; Optical feedback; Optical sensors; SPICE; Solid modeling; Temperature sensors; Thermal conductivity; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216518
Filename
1216518
Link To Document